Publication Type
Conference Proceeding Article
Version
publishedVersion
Publication Date
5-2023
Abstract
Welcome to the 6th ACM/IEEE International Conference on Technical Debt, TechDebt 2023, co-located with the International Conference on Software Engineering (ICSE) 2023, in the beautiful city of Melbourne, Australia. After several years of virtual and hybrid conferences, TechDebt 2023 marks the first predominantly in-person edition of the conference series since the onset of the Covid-19 pandemic.
Discipline
Software Engineering
Research Areas
Software and Cyber-Physical Systems
Publication
Proceedings of the 2023 ACM/IEEE International Conference on Technical Debt (TechDebt), Melbourne, Australia, May 14-15
First Page
vii
Last Page
viii
ISBN
9798350311945
Identifier
10.1109/TechDebt59074.2023.00005
Publisher
IEEE
City or Country
Piscataway, NJ
Citation
TREUDE, Christoph; CAI, Yuanfang; XIA, Xin; CODABUX, Zadia; HATA, Hideaki; DEISSENBOECK, Florian; and SPINOLA, Rodrigo.
Message from the Chairs: TechDebt 2023. (2023). Proceedings of the 2023 ACM/IEEE International Conference on Technical Debt (TechDebt), Melbourne, Australia, May 14-15. vii-viii.
Available at: https://ink.library.smu.edu.sg/sis_research/8954
Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-No Derivative Works 4.0 International License.
Additional URL
https://doi.org/10.1109/TechDebt59074.2023.00005