Publication Type

Conference Proceeding Article

Version

acceptedVersion

Publication Date

2-2008

Abstract

We summarize the results of a European Project entitled WAPITI (Waferbonding and Active Passive Integration Technology and Implementation) dealing with the fabrication and investigation of active/passive vertically coupled ring resonators, wafer bonded on GaAs, and based on full wafer technology. The concept allows for the integration of an active ring laser vertically coupled to a transparent bus waveguide. All necessary layers are grown in a single epitaxial run so that the critical coupling gap can be precisely controlled with the high degree of accuracy of epitaxial growth. One key challenge of the project was to establish a reliable wafer bonding technique using BCB as an intermediate layer. In intensive tests we investigated and quantified the effect of unavoidable shrinkage of the BCB on the overall device performance. Results on cw-operation, low threshold currents of about 8 mA, high side-mode suppression ratios in the range of 40 dB and large signal modulation bandwidths of up to 5 GHz for a radius of 40 μm shows the viability of the integration process.

Keywords

Continuous wave operation, Fabrication, Gallium arsenide, Lasers, Microrings, Modulation, Resonators, Wafer bonding, Waveguides

Discipline

Physical Sciences and Mathematics

Research Areas

Quantitative Finance

Publication

Proceedings of SPIE: Integrated Optoelectronic Devices 2008, San Jose

Volume

6869

First Page

1

Last Page

8

ISSN

5650-1569

Identifier

10.1117/12.762507

Publisher

SPIE

City or Country

Bellingham, WA

Copyright Owner and License

Authors

Additional URL

https://doi.org/10.1117/12.762507

Download

Share

COinS