Publication Type

Conference Proceeding Article

Version

publishedVersion

Publication Date

7-2020

Abstract

Addressing issue reports is an integral part of open source software (OSS) projects. Although several studies have attempted to discover the factors that affect issue resolution, few pay attention to the underlying micro-process patterns of resolution processes. Discovering these micro-patterns will help us understand the dynamics of issue resolution processes so that we can manage and improve them in better ways. Of the various types of issues, those relating to corrective maintenance account for nearly half hence resolving these issues efficiently is critical for the success of OSS projects. Therefore, we apply process mining techniques to discover the micro-patterns of resolution processes for issues relating to corrective maintenance. Four and five typical patterns are found for the identification stage and solving stage of the resolution processes respectively. Furthermore, it is shown that the consequent patterns can be predicted with a certain degree of accuracy by selecting the appropriate features and models. Furthermore, we make use of the pattern information predicted to forecast the issue lifetime and the results show that this information can also improve the accuracy in the earlier observation points. At the same time, pattern predictions provide good interpretability to the forecast of issue lifetime.

Keywords

Issue lifetime prediction, Issue pattern prediction, Issue resolution, Micro-pattern, Process mining

Discipline

Software Engineering

Research Areas

Software and Cyber-Physical Systems

Publication

Proceedings of the 32nd International Conference on Software Engineering and Knowledge Engineering (SEKE 2020): July 9-19, Virtual

First Page

477

Last Page

482

ISBN

1891706500

Identifier

10.18293/SEKE2020-031

Publisher

Knowledge Systems Institute Graduate School

City or Country

Pittsburgh

Copyright Owner and License

Authors

Additional URL

https://doi.org/10.18293/SEKE2020-031

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