Mode-Expanded Bus Architecture for Non-Sensitive Waveguide Alignment in Vertically-Coupled Microring
Publication Type
Conference Proceeding Article
Publication Date
9-2006
Abstract
We demonstrate experimentally a five-fold improvement in fabrication tolerance for vertically-coupled microrings using a mode-expanded bus waveguide. The power coupling coefficient is observed to vary by only 6% for misalignment as high as 1um.
Keywords
Communication, Networking & Broadcasting, Components, Circuits, Devices & Systems, Engineered Materials, Dielectrics & Plasmas, Photonics & Electro-Optics, Signal Processing & Analysis
Discipline
Physical Sciences and Mathematics
Research Areas
Quantitative Finance
Publication
2006 European Conference of Optics Communications ECOC: Cannes, September 24-28: Proceedings
First Page
1
Last Page
2
ISBN
9782912328397
Identifier
10.1109/ECOC.2006.4801189
Publisher
IEEE
City or Country
Piscataway, NJ
Citation
TEE, Chyng Wen; Williams, K. A.; Penty, R. V.; White, I. H.; Hamacher, M.; Troppenz, U.; and Heidrich, H..
Mode-Expanded Bus Architecture for Non-Sensitive Waveguide Alignment in Vertically-Coupled Microring. (2006). 2006 European Conference of Optics Communications ECOC: Cannes, September 24-28: Proceedings. 1-2.
Available at: https://ink.library.smu.edu.sg/lkcsb_research/3355
Additional URL
https://doi.org/10.1109/ECOC.2006.4801189